EnSilica, a leading independent provider of semiconductor solutions and IP, and sureCore, the low power SRAM IP leader, have announced that EnSilica has developed sureCore’s new, ultra-low power IoT reference platform targeted principally at the development of the next generation of wearable consumer and medical applications.
With proven expertise in low power SoC design for battery powered applications, EnSilica’s experienced silicon team is able to deliver a complete, turn-key service covering complex digital and analogF technologies for both ASICs and SoCs down to 28nm. The service extends from system architecting and design specification through development and implementation to the supply of production silicon. EnSilica also offers point services within the whole systems design, development and IC supply cycle. Additionally, EnSilica maintains in-depth partnership with all the major silicon foundries.
The sureCore IoT reference platform has been taped out using TSMC’s commercially available 40nm Ultra Low Power (40ULP) process technology. TSMC’s 40nm process integrates 193nm immersion lithography technology and ultra-low-k connection material to increase chip performance, while simultaneously lowering power consumption. Specifically developed for IoT and wearable applications, TSMC’s 40ULP process cuts leakage current by up to 70% and lowers power consumption by up to 30% compared to its Low Power (LP) process.
The sureCore IoT reference platform incorporates derivations of both its EverOn and PowerMiser SRAM IP product lines. By examining the fundamental limitations of conventional SRAM architecture to develop novel, patented circuit designs, architecture techniques, and assist circuits, coupled with foundry-supplied, high density SRAM bit cells, sureCore’s SRAM IP is capable of operation at near-threshold bit cell retention voltages and delivering significant dynamic/static power savings. EverOn is capable of operation with supply voltages between 1.21V and 0.6V on commercially available 40ULP processes, across process corners, and across a -40°C to +125°C temperature range. The PowerMiser SRAM family delivers more than 50% dynamic power savings and approximately 20% static power savings compared to industry standard SRAMs available on commercially available 40ULP processes.
“With proven experience of delivering low power design services, EnSilica was a natural choice for the implementation of our new ultra-low power IoT reference platform,” said Eric Gunn, COO of sureCore. “With a demonstrable understanding of how near threshold design can meet customer expectations for battery powered applications, we knew that EnSilica would be able to proceed quickly to successful tape-out. EnSilica’s technical appreciation of our technology, as well as deep understanding of TSMC’s processes, has ensured a painless route to tape-out.”
“We are pleased to be extending our relationship with sureCore on the implementation of its new ultra-low power IoT reference platform,” said Ian Lankshear, CEO of EnSilica. “Its EverOn and PowerMiser SRAM IPs are proving a game-changer when it comes to providing SoC developers with ultra-low power, area-efficient memories and its new, ultra-low power IoT reference platform looks set to make the same impact on the next generation of wearable consumer and medical applications.”