Broadex Technologies (Shenzhen Stock Exchange 300548), a leading provider of optoelectronic components to the telecom and datacom markets, announces our presentation on The Future and Economics of PICs and PLCs in PON Systems for Data Centre and Mobile Backhaul Applications, at the PIC International Conference. To hear the talk, join us in the PIC ROI – Quality Metrics & Scalability session, at 15.35 on Wednesday 10th November.
“We will look into the specific requirements for passive chips for mux and demux functions in CWDM 400Gb datacenter application, DWDM Datacenter interconnects and 5G backhaul and fronthaul applications”, said Dr. Henk Bulthuis, R&D Director at Broadex Technologies, “New products have emerged for these new application areas, including ultra-wide band AWGs and low loss AWGs. We will discuss the challenges of their design and fabrication.”
About the PIC International Conference
The 5th PIC International conference will build on the success of its predecessors, with industry-leading insiders delivering more than 30 presentations spanning 5 sectors.
Attendees at the two-day conference will gain an up-to-date overview of the status of the Photonics industry and will have the opportunity to meet many other key players within the community. Find out more